US Patent Issued to Intel on July 8 for "Compliance and debug testing of a die-to-die interconnect" (California Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,353,305, issued on July 8, was assigned to Intel Corp. (Santa Clara, Calif.).

"Compliance and debug testing of a die-to-die interconnect" was invented by Swadesh Choudhary (Mountain View, Calif.), Narasimha Lanka (Dublin, Calif.), Debendra Das Sharma (Saratoga, Calif.), Lakshmipriya Seshan (Sunnyvale, Calif.), Zuoguo Wu (San Jose, Calif.) and Gerald Pasdast (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, an apparatus comprises a first die that includes: a die-to-die adapter comprising a plurality of first registers, the die-to-die adapter to communicate with protocol layer circuitry via a flit-aware die-to-die interfac...