US Patent Issued to Intel on July 29 for "Microelectronic assemblies having topside power delivery structures" (German, American Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,625, issued on July 29, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assemblies having topside power delivery structures" was invented by Bernd Waidhas (Pettendorf, Germany), Carlton Hanna (Santa Clara, Calif.), Stephen Morein (San Jose, Calif.), Lizabeth Keser (San Diego) and Georg Seidemann (Landshut, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate, having a surface, including a first conductive pathway electrically coupled to a power source; an insulating mater...