US Patent Issued to Intel on July 29 for "Integrated circuit assemblies with stacked compute logic and memory dies" (California, Oregon Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,666, issued on July 29, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated circuit assemblies with stacked compute logic and memory dies" was invented by Prashant Majhi (San Jose, Calif.), Brian S. Doyle (Portland, Ore.), Abhishek A. Sharma (Hillsboro, Ore.) and Van H. Le (Beaverton, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit (IC) assemblies with stacked compute logic and memory dies, and associated systems and methods, are disclosed. One example IC assembly includes a compute logic die and a stack of memory dies provided above and coupled to the compute logic die, where one or more of the memory dies closest ...