US Patent Issued to Intel on July 29 for "Atomic handling for disaggregated 3D structured SoCs" (Indian, American Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,373,348, issued on July 29, was assigned to Intel Corp. (Santa Clara, Calif.).

"Atomic handling for disaggregated 3D structured SoCs" was invented by Rahul Pal (Bangalore, India), Aravindh Anantaraman (Folsom, Calif.), Lakshminarayana Pappu (Folsom, Calif.), Dongsheng Bi (Fremont, Calif.), Guadalupe J. Garcia (Chandler, Ariz.), Altug Koker (El Dorado Hills, Calif.), Joydeep Ray (Folsom, Calif.), Rahul Joshi (Pune, India), Shrikul Atulkumar Joshi (Rajkot, India) and Mahak Gupta (Bengaluru, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a further embodiment, a system on a chip integrated circuit (SoC) is provided that includes an active base die ...