US Patent Issued to Intel on July 29 for "Architectures and methods of fabricating 3D stacked packages" (Arizona Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,626, issued on July 29, was assigned to Intel Corp. (Santa Clara, Calif.).

"Architectures and methods of fabricating 3D stacked packages" was invented by Vijay K. Nair (Mesa, Ariz.), Feras Eid (Chandler, Ariz.) and Thomas Sounart (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Electronics package device technology is disclosed. In one example, an electronics package device (202) comprises substrate (206) supporting an electronics component (208) and an interconnect via (216a-c) electrically coupled to the electronics component such that at least a portion of the electronics component is disposed between the interconnect via and the s...