US Patent Issued to Intel on July 22 for "Package substrate with glass core having vertical power planes for improved power delivery" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,091, issued on July 22, was assigned to Intel Corp. (Santa Clara, Calif.).

"Package substrate with glass core having vertical power planes for improved power delivery" was invented by Aleksandar Aleksov (Chandler, Ariz.), Telesphor Kamgaing (Chandler, Ariz.), Veronica Strong (Hillsboro, Ore.), Georgios C. Dogiamis (Chandler, Ariz.) and Neelam Prabhu Gaunkar (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment the package substrate comprises a core and buildup layers on the core. In an embodiment, first level interconnec...