ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,089, issued on July 22, was assigned to Intel Corp. (Santa Clara, Calif.).
"Low cost embedded integrated circuit dies" was invented by Xavier Francois Brun (Hillsboro, Ore.) and Sanka Ganesan (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An example microelectronic assembly comprises a support structure; an interposer above the support structure; a first die in the interposer, the first die including through-substrate vias (TSVs); and a second die in the interposer, the second die lacking TSVs. A die-to-package support (DTPS) interconnect field on a first face of the first die is substantially identical to a DTPS interconnect field ...