US Patent Issued to Intel on July 22 for "Heat dissipation structures for optical communication devices" (Arizona, California Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,366,713, issued on July 22, was assigned to Intel Corp. (Santa Clara, Calif.).

"Heat dissipation structures for optical communication devices" was invented by Omkar Karhade (Chandler, Ariz.), Tolga Acikalin (San Jose, Calif.), Sushrutha Gujjula (Chandler, Ariz.), Kelly Lofgreen (Phoenix), Ravindranath Mahajan (Chandler, Ariz.) and Chia-pin Chiu (Tempe, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate and a photonic integrated circuit device attached thereto, wherein the package substrate includes a heat dissipation structure disposed therein. ...