US Patent Issued to Intel on July 15 for "Semiconductor structure and method for forming a semiconductor structure" (German Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,241, issued on July 15, was assigned to Intel Corp. (Santa Clara, Calif.).

"Semiconductor structure and method for forming a semiconductor structure" was invented by Richard Geiger (Munich), Klaus Herold (Munich), Harald Gossner (Riemerling, Germany), Martin Ostermayr (Woerth, Germany), Georgios Panagopoulos (Munich), Johannes Rauh (Kirchseeon, Germany), Joachim Singer (Neubiberg, Germany) and Thomas Wagner (Regelsbach, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure is provided. The semiconductor structure includes a plurality of transistors arranged at a front side of a semiconductor substrate and a test structure ...