ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,297, issued on July 15, was assigned to Intel Corp. (Santa Clara, Calif.).
"Semiconductor packages with antennas" was invented by Telesphor Kamgaing (Chandler, Ariz.), Adel A. Elsherbini (Chandler, Ariz.) and Sasha N. Oster (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in...