US Patent Issued to Intel on July 15 for "Monolithic chip stacking using a die with double-sided interconnect layers" (Oregon Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,325, issued on July 15, was assigned to Intel Corp. (Santa Clara, Calif.).

"Monolithic chip stacking using a die with double-sided interconnect layers" was invented by Anup Pancholi (Hillsboro, Ore.) and Kimin Jun (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus is provided which comprises: a first die having a first surface and a second surface, the first die comprising: a first layer formed on the first surface of the first die, and a second layer formed on the second surface of the first die; a second die coupled to the first layer; and a plurality of structures to couple the apparatus to an external component, wherein ...