US Patent Issued to Intel on July 15 for "Fan out package with integrated peripheral devices and methods" (German Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,251, issued on July 15, was assigned to Intel Corp. (Santa Clara, Calif.).

"Fan out package with integrated peripheral devices and methods" was invented by Lizabeth Keser (Munich), Bernd Waidhas (Pettendorf, Germany), Thomas Ort (Veitsbronn, Germany) and Thomas Wagner (Regelsbach, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and method of including peripheral devices into a package is disclosed. In one example, a peripheral device includes a passive device such as a capacitor or an inductor. Examples are shown that include a peripheral device that is substantially the same thickness as a die or a die assembly. Exampl...