US Patent Issued to Intel on July 15 for "Composite interposer structure and method of providing same" (Arizona, California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,284, issued on July 15, was assigned to Intel Corp. (Santa Clara, Calif.).

"Composite interposer structure and method of providing same" was invented by Adel Elsherbini (Tempe, Ariz.), Shawna Liff (Scottsdale, Ariz.), Johanna Swan (Scottsdale, Ariz.) and Gerald Pasdast (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques and mechanisms for high interconnect density communication with an interposer. In some embodiments, an interposer comprises a substrate and portions disposed thereon, wherein respective inorganic dielectrics of said portions adjoin each other at a material interface, which extends to each of the substrate and ...