US Patent Issued to Intel on July 15 for "Backside recess in motherboard with thermally conductive mold" (American, Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,831, issued on July 15, was assigned to Intel Corp. (Santa Clara, Calif.).

"Backside recess in motherboard with thermally conductive mold" was invented by Kaladhar Radhakrishnan (Chandler, Ariz.) and Wei Shen (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include microelectronic boards and electronic systems. In an embodiment, a microelectronic board comprises aboard substrate, where the board substrate has a first thickness between a first surface and a second surface opposite from the first surface. In an embodiment, a recess is formed into the first surface of the board substrate, where the recess comprises ...