US Patent Issued to Intel on July 1 for "Semiconductor dies and devices with a coil for inductive coupling" (German Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,796, issued on July 1, was assigned to Intel Corp. (Santa Clara, Calif.).

"Semiconductor dies and devices with a coil for inductive coupling" was invented by Martin Ostermayr (Woerth, Germany), Walther Lutz (Erding, Germany), Joachim Assenmacher (Unterhaching, Germany) and Georg Seidemann (Landshut, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die is disclosed, including circuitry comprising a transistor at a frontside of a semiconductor substrate, and a backside inductor at a backside of the semiconductor substrate. The backside inductor is electrically connected to the transistor of the circuitry."

The patent was filed on...