US Patent Issued to Intel on July 1 for "Microelectronic assemblies with direct attach to circuit boards" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,782, issued on July 1, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assemblies with direct attach to circuit boards" was invented by Sanka Ganesan (Chandler, Ariz.), William J. Lambert (Chandler, Ariz.), Bharat Prasad Penmecha (Phoenix) and Xavier Francois Brun (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first redistribution layer (RDL), having a first surface with first conductive contacts having a first pitch between 170 microns and 400 microns, an opposing second sur...