ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,274, issued on July 1, was assigned to Intel Corp. (Santa Clara, Calif.).
"Low profile SODIMM (small outline dual inline memory module)" was invented by Raghavendra Rao (Bangalore, India), Ranjul Balakrishnan (Bangalore, India), Shailendra Singh Chauhan (Bengaluru, India) and Sandesh Krishnamurthy Geejagaaru (Bangalore, India).
According to the abstract* released by the U.S. Patent & Trademark Office: "A memory module has pads on the top and bottom surfaces of a module printed circuit board (PCB). The pads match the pin layout of one or more memory devices to be mounted on the memory module. The pads on one surface of the PCB electrically interconnect to the memory device(s), and ...