ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,303, issued on July 1, was assigned to Intel Corp. (Santa Clara, Calif.).

"Low force liquid metal interconnect solutions" was invented by Karumbu Meyyappan (Portland, Ore.), Kyle Arrington (Gilbert, Ariz.), David Craig (Hillsboro, Ore.) and Pooya Tadayon (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate having a first surface and a second surface opposite from the first surface, and a die on the first surface of the package substrate. In an embodiment, the electronic package further comprises a socket interfa...