US Patent Issued to Intel on July 1 for "Logic die in a multi-chip package having a configurable physical interface to on-package memory" (California, Washington Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,818, issued on July 1, was assigned to Intel Corp. (Santa Clara, Calif.).

"Logic die in a multi-chip package having a configurable physical interface to on-package memory" was invented by Narasimha Lanka (Dublin, Calif.), Lohit Yerva (Mountain View, Calif.), Mohammad Rashid (San Jose, Calif.) and Kuljit S. Bains (Olympia, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-chip device having a configurable physical interface in a logic die to on-package memory is provided. The configurable physical interface to allow a connection from a signal on the memory interface to be selected based on whether the logic die is mirrored or non-mirrored."...