US Patent Issued to Intel on July 1 for "Interconnect fabric link width reduction to reduce instantaneous power consumption" (American, Indian, British Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,346,189, issued on July 1, was assigned to Intel Corp. (Santa Clara, Calif.).

"Interconnect fabric link width reduction to reduce instantaneous power consumption" was invented by Mohammed Tameem (Bangalore, India), Altug Koker (El Dorado Hills, Calif.), Kiran C. Veernapu (Bangalore, India), Abhishek R. Appu (El Dorado Hills, Calif.), Ankur N. Shah (Folsom, Calif.), Joydeep Ray (Folsom, Calif.), Travis T. Schluessler (Hillsboro, Ore.) and Jonathan Kennedy (Bristol, Great Britain).

According to the abstract* released by the U.S. Patent & Trademark Office: "Described herein are various embodiments of reducing dynamic power consumption within a processor device. One embodiment provides a ...