US Patent Issued to Intel on July 1 for "Glass substrates having signal shielding for use with semiconductor packages and related methods" (Arizona Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,788, issued on July 1, was assigned to Intel Corp. (Santa Clara, Calif.).

"Glass substrates having signal shielding for use with semiconductor packages and related methods" was invented by Kristof Darmawikarta (Chandler, Ariz.), Srinivas V. Pietambaram (Chandler, Ariz.), Kemal Aygun (Tempe, Ariz.), Telesphor Kamgaing (Chandler, Ariz.), Zhiguo Qian (Chandler, Ariz.) and Jiwei Sun (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Glass substrates having signal shielding for use with semiconductor packages and related methods are disclosed. An example semiconductor package includes a core layer defining a channel and a through glass via (T...