US Patent Issued to Intel on July 1 for "Capacitors in through glass vias" (Arizona Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,282, issued on July 1, was assigned to Intel Corp. (Santa Clara, Calif.).

"Capacitors in through glass vias" was invented by Benjamin Duong (Chandler, Ariz.), Aleksandar Aleksov (Chandler, Ariz.), Helme A. Castro De La Torre (Gilbert, Ariz.), Kristof Darmawikarta (Chandler, Ariz.), Darko Grujicic (Chandler, Ariz.), Sashi S. Kandanur (Phoenix), Suddhasattwa Nad (Chandler, Ariz.), Srinivas V. Pietambaram (Chandler, Ariz.), Rengarajan Shanmugam (Chandler, Ariz.), Thomas L. Sounart (Chandler, Ariz.) and Marcel Wall (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein may be related to apparatuses, processes, and techniques...