ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,898, issued on Jan. 28, was assigned to Intel Corp. (Santa Clara, Calif.).
"Device contact sizing in integrated circuit structures" was invented by Guillaume Bouche (Portland, Ore.), Andy Chih-Hung Wei (Yamhill, Ore.) and Sean T. Ma (Portland, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Discussed herein is device contact sizing in integrated circuit (IC) structures. In some embodiments, an IC structure may include: a first source/drain (S/D) contact in contact with a first S/D region, and a second S/D contact in contact with a second S/D region, wherein the first S/D region and the second S/D region have a same length, and the first S/D cont...