US Patent Issued to Intel on Jan. 27 for "Substrate for improved heat dissipation and method" (German, American Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,797, issued on Jan. 27, was assigned to Intel Corp. (Santa Clara, Calif.).

"Substrate for improved heat dissipation and method" was invented by Carlton Hanna (San Jose, Calif.), Wolfgang Molzer (Ottobrunn, Germany), Stefan Reif (Munich), Georg Seidemann (Landshut, Germany), Stephan Stoeckl (Schwandorf, Germany) and Pouya Talebbeydokhti (Gilbert, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package comprises a package substrate comprised of at least a first layer of dielectric material including a portion of diamond dust material. The diamond dust material is comprised of diamond dust particles. The semiconductor package inclu...