US Patent Issued to Intel on Jan. 27 for "Device, system and method to deliver power with phase circuits of an integrated circuit die" (American, Israeli Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,433, issued on Jan. 27, was assigned to Intel Corp. (Santa Clara, Calif.).

"Device, system and method to deliver power with phase circuits of an integrated circuit die" was invented by Tamir Salus (Zichron Yaakov, Israel), Shunjiang Xu (Milpitas, Calif.) and Christopher Schaef (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques and mechanisms for facilitating a scalable delivery of current to an inductor of a voltage regulator. In an embodiment, a hardware interface of integrated circuit (IC) die accommodates coupling of the IC die to multiple inductors. The hardware interface comprises contacts which are each to couple the IC...