ALEXANDRIA, Va., Jan. 23 -- United States Patent no. 12,207,409, issued on Jan. 21, was assigned to Intel Corp. (Santa Clara, Calif.).
"Modular capacitor subassembly for backup power" was invented by John Hung (Vancouver, Canada), Andrew Morning-Smith (Vancouver, Canada), Kai-Uwe Schmidt (Vancouver, Canada) and Nan Allison Yao (Regina, Canada).
According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment of an electronic system comprises a main board, and a modular capacitor subassembly mechanically and electrically coupled to the main board, wherein the modular capacitor subassembly provides backup power for the main board, and wherein the main board is adapted for use in at least two housing form factors. Ot...