US Patent Issued to Intel on Jan. 20 for "Porous mesh structures for the thermal management of integrated circuit devices" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,740, issued on Jan. 20, was assigned to Intel Corp. (Santa Clara, Calif.).

"Porous mesh structures for the thermal management of integrated circuit devices" was invented by Feras Eid (Chandler, Ariz.), Wenhao Li (Chandler, Ariz.), Paul Diglio (Gaston, Ore.), Xavier Brun (Hillsboro, Ore.) and Johanna Swan (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A porous mesh structure for use in the thermal management of integrated circuit devices may be formed as a solid matrix with a plurality of pores dispersed therein, wherein the solid matrix may be a plurality of fused matrix material particles and the plurality of pores may comprise b...