US Patent Issued to Intel on Jan. 20 for "Metal matrix composite layers having graded filler content for heat dissipation from integrated circuit devices" (American, Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,739, issued on Jan. 20, was assigned to Intel Corp. (Santa Clara, Calif.).

"Metal matrix composite layers having graded filler content for heat dissipation from integrated circuit devices" was invented by Feras Eid (Chandler, Ariz.), Wenhao Li (Chandler, Ariz.) and Yoshihiro Tomita (Tsukuba, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit assembly may be fabricated to include an integrated circuit device having a backside surface and a metal matrix composite layer on the backside surface, wherein the metal matrix composite layer has a filler material disposed therein that has a graded content to reduce the coefficient of t...