US Patent Issued to Intel on Jan. 13 for "Ultra small molded module integrated with die by module-on-wafer assembly" (Japanese, American Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,544, issued on Jan. 13, was assigned to Intel Corp. (Santa Clara, Calif.).

"Ultra small molded module integrated with die by module-on-wafer assembly" was invented by Yoshihiro Tomita (Tsukuba, Japan), Eric J. Li (Chandler, Ariz.), Shawna M. Liff (Scottsdale, Ariz.), Javier A. Falcon (Chandler, Ariz.) and Joshua D. Heppner (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the invention include molded modules and methods for forming molded modules. According to an embodiment the molded modules may be integrated into an electrical package. Electrical packages according to embodiments of the invention may include a die with...