US Patent Issued to Intel on Jan. 13 for "Photonic integrated circuit to glass substrate alignment through dual cylindrical lens" (Arizona, Oregon, California Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,523,827, issued on Jan. 13, was assigned to Intel Corp. (Santa Clara, Calif.).

"Photonic integrated circuit to glass substrate alignment through dual cylindrical lens" was invented by Changhua Liu (Chandler, Ariz.), Pooya Tadayon (Portland, Ore.), John Heck (Berkeley, Calif.) and Srikant Nekkanty (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device comprises a photonic integrated circuit (PIC) including at least one optical signal source, an emitting lens disposed on the PIC to steer light emitted by the at least one optical signal source in a direction substantially parallel to a first surface of the PIC, and an optical ...