US Patent Issued to Intel on Jan. 13 for "Microelectronic assemblies with adaptive multi-layer encapsulation materials" (Arizona Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,497, issued on Jan. 13, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assemblies with adaptive multi-layer encapsulation materials" was invented by Liang He (Chandler, Ariz.), Yue Deng (Chandler, Ariz.), Jung Kyu Han (Chandler, Ariz.) and Gang Duan (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface and an opposing second surface with conductive contacts, in a first layer; a first material surrounding the first die and extending along a thickne...