US Patent Issued to Intel on Jan. 13 for "Microelectronic assemblies including stacked dies coupled by a through dielectric via" (California, Arizona Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,563, issued on Jan. 13, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assemblies including stacked dies coupled by a through dielectric via" was invented by Stephen Morein (San Jose, Calif.), Ravindranath Vithal Mahajan (Chandler, Ariz.) and Prashant Majhi (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. In some embodiments, a microelectronic assembly may include a plurality of dies stacked vertically; a trench of dielectric material extending through the plurality of dies; a conductive via extending through the trench o...