US Patent Issued to Intel on Jan. 13 for "Interconnect line structures with metal chalcogenide cap materials" (Oregon Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,488, issued on Jan. 13, was assigned to Intel Corp. (Santa Clara, Calif.).

"Interconnect line structures with metal chalcogenide cap materials" was invented by Carl H. Naylor (Portland, Ore.) and Christopher Jezewski (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit interconnect structures including an interconnect line metallization feature subjected to one or more chalcogenation techniques to form a cap may reduce line resistance. A top portion of a bulk line material may be advantageously crystallized into a metal chalcogenide cap with exceptionally large crystal structure. Accordingly, chalcogenation of a top port...