ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,969, issued on Jan. 13, was assigned to Intel Corp. (Santa Clara, Calif.).
"High speed grid array module" was invented by Shailendra Singh Chauhan (Bengaluru, India), Raghavendra Rao (Bangalore, India), Ranjul Balakrishnan (Bangalore, India), Nizamuddin Shaik (Portland, Ore.), Bijendra Singh (Bangalore, India), Siva Prasad Jangili Ganga (Bengaluru, India) and Dong-Ho Han (Beaverton, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A system board includes a module board that connects to the system board with an interposer having compressible connectors. The module board can further be covered by a shield that has a metal alloy having an element to...