US Patent Issued to Intel on Jan. 13 for "HBI die fiducial architecture with cantilever fiducials for smaller die size and better yields" (Arizona Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,545, issued on Jan. 13, was assigned to Intel Corp. (Santa Clara, Calif.).

"HBI die fiducial architecture with cantilever fiducials for smaller die size and better yields" was invented by Omkar Karhade (Chandler, Ariz.) and Nitin A. Deshpande (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include semiconductor devices. In an embodiment, a die comprises a substrate, where the substrate comprises a semiconductor material. In an embodiment a fiducial is on the substrate. In an embodiment, the fiducial is a cantilever beam that extends out past an edge of the substrate."

The patent was filed on Dec. 23, 202...