US Patent Issued to Intel on Jan. 13 for "Assembly of 2XD module using high density interconnect bridges" (German Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,562, issued on Jan. 13, was assigned to Intel Corp. (Santa Clara, Calif.).

"Assembly of 2XD module using high density interconnect bridges" was invented by Bernd Waidhas (Pettendorf, Germany), Andreas Wolter (Regensburg, Germany), Georg Seidemann (Landshut, Germany) and Thomas Wagner (Regelsbach, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch...