US Patent Issued to Intel on Feb. 4 for "Source ordering in device interconnects" (California Inventor)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,216,607, issued on Feb. 4, was assigned to Intel Corp. (Santa Clara, Calif.).

"Source ordering in device interconnects" was invented by Debendra Das Sharma (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, an apparatus includes a port to transmit and receive data over a link; and protocol stack circuitry to implement one or more layers of a load-store input/output (I/O)-based protocol (e.g., PCIe or CXL) across the link. The protocol stack circuitry constructs memory write request transaction layer packets (TLPs) for memory write transactions, wherein fields of the memory write request TLPs indicate a virtual channel (VC...