US Patent Issued to Intel on Feb. 4 for "Nested interposer with through-silicon via bridge die" (Arizona Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,040, issued on Feb. 4, was assigned to Intel Corp. (Santa Clara, Calif.).

"Nested interposer with through-silicon via bridge die" was invented by Srinivas V. Pietambaram (Chandler, Ariz.), Debendra Mallik (Chandler, Ariz.), Kristof Darmawikarta (Chandler, Ariz.), Ravindranath V. Mahajan (Chandler, Ariz.) and Rahul N. Manepalli (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package includes an interposer having an interposer substrate, a cavity that passes into but not through the interposer substrate, a through interposer via (TIV) within the interposer substrate, and an interposer pad electrically coupled to the TIV. T...