US Patent Issued to Intel on Feb. 3 for "Scalable package architecture using reticle stitching and photonics for integrated circuits" (California, Oregon Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,594, issued on Feb. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Scalable package architecture using reticle stitching and photonics for integrated circuits" was invented by Satish Damaraju (El Dorado Hills, Calif.), Scott E. Siers (Elk Grove, Calif.), Altug Kokar (El Dorado Hills, Calif.), Wilfred Gomes (Portland, Ore.) and Mark C. Davis (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of a microelectronic assembly comprise a first integrated circuit (IC) die including a plurality of first circuits separated by scribe regions, and a plurality of second IC dies coupled to the first IC die, each one of the second IC...