US Patent Issued to Intel on Feb. 3 for "Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems" (Arizona, Iowa Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,358, issued on Feb. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems" was invented by Feras Eid (Chandler, Ariz.), Sasha N. Oster (Marion, Iowa), Telesphor Kamgaing (Chandler, Ariz.), Georgios C. Dogiamis (Chandler, Ariz.) and Aleksandar Aleksov (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second subst...