US Patent Issued to Intel on Feb. 3 for "Electronic packaging architecture with customized variable metal thickness on same buildup layer" (Arizona Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,578, issued on Feb. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Electronic packaging architecture with customized variable metal thickness on same buildup layer" was invented by Jeremy D. Ecton (Gilbert, Ariz.), Kristof Darmawikarta (Chandler, Ariz.), Suddhasattwa Nad (Chandler, Ariz.), Oscar Ojeda (Chandler, Ariz.), Bai Nie (Chandler, Ariz.), Brandon C. Marin (Gilbert, Ariz.), Gang Duan (Chandler, Ariz.), Jacob Vehonsky (Gilbert, Ariz.), Onur Ozkan (Scottsdale, Ariz.) and Nicholas S. Haehn (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic packages and methods of forming such ...