US Patent Issued to Intel on Feb. 3 for "Chiplet architecture for late bind SKU fungibility" (Oregon, California Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,541,476, issued on Feb. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Chiplet architecture for late bind SKU fungibility" was invented by Mark C. Davis (Portland, Ore.), Hong Jiang (Los Altos, Calif.) and Satish Damaraju (El Dorado Hills, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Described herein is a modular parallel processor comprising an active base die including hardware logic, interconnect logic, and a plurality of chiplet slots and a plurality of chiplets vertically stacked on the active base die and coupled with the plurality of chiplet slots of the active base die. The plurality of chiplets is interchangeable during assembly...