US Patent Issued to Intel on Feb. 25 for "Integrated circuit package having wirebonded multi-die stack" (German Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,237,305, issued on Feb. 25, was assigned to Intel Corp..

"Integrated circuit package having wirebonded multi-die stack" was invented by Thorsten Meyer (Regensburg, Germany), Pauli Jaervinen (Wallerfing, Germany) and Richard Patten (Langquaid, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure are directed towards an integrated circuit (IC) package including a first die at least partially embedded in a first encapsulation layer and a second die at least partially embedded in a second encapsulation layer. The first die may have a first plurality of die-level interconnect structures disposed at a first side of the ...