ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,536, issued on Feb. 18, was assigned to Intel Corp. (Santa Clara, Calif.).
"Self-assembled guided hole and via patterning over grating" was invented by Florian Gstrein (Portland, Ore.), Eungnak Han (Portland, Ore.), Manish Chandhok (Beaverton, Ore.) and Gurpreet Singh (Portland, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Described herein are IC devices include vias deposited in a regular array, e.g., a hexagonal array, and processes for depositing vias in a regular array. The process includes depositing a guiding pattern over a metal grating, depositing a diblock copolymer over the guiding pattern, and causing the diblock copolymer to self-...