US Patent Issued to Intel on Feb. 18 for "Double-sided substrate with cavities for direct die-to-die interconnect" (Oregon Inventor)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,610, issued on Feb. 18, was assigned to Intel Corp. (Santa Clara, Calif.).

"Double-sided substrate with cavities for direct die-to-die interconnect" was invented by Pooya Tadayon (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments include a package substrate and semiconductor packages. A package substrate includes a first cavity in a top surface, first conductive pads on a first surface of the first cavity, a second cavity in a bottom surface, second conductive pads on a second surface of the second cavity, where the first surface is above the second surface, and a third cavity in the first and second cavities, where the third...