US Patent Issued to Intel on Feb. 17 for "Cladding and condensation for strained semiconductor nanoribbons" (Oregon Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,340, issued on Feb. 17, was assigned to Intel Corp. (Santa Clara, Calif.).

"Cladding and condensation for strained semiconductor nanoribbons" was invented by Ashish Agrawal (Hillsboro, Ore.), Anand Murthy (Portland, Ore.), Jack T. Kavalieros (Portland, Ore.), Rajat K. Paul (Portland, Ore.), Gilbert Dewey (Beaverton, Ore.), Susmita Ghose (Hillsboro, Ore.) and Seung Hoon Sung (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques are provided herein to form semiconductor devices having nanowires with an increased strain. A thin layer of silicon germanium or germanium tin can be deposited over one or more suspended nanoribbons. An an...