US Patent Issued to Intel on Feb. 10 for "Via profile shrink for advanced integrated circuit structure fabrication" (Oregon, Ohio Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,698, issued on Feb. 10, was assigned to Intel Corp. (Santa Clara, Calif.).

"Via profile shrink for advanced integrated circuit structure fabrication" was invented by Tiffany Zink (Sheridan, Ore.), Shashi Vyas (Euclid, Ohio), Weimin Han (Portland, Ore.), Sudipto Naskar (Portland, Ore.) and Charles H. Wallace (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the disclosure are in the field of integrated circuit structure fabrication. In an example, an integrated circuit structure includes an inter-layer dielectric (ILD) layer over a conductive interconnect line, the ILD layer having a trench therein, the trench exposing a p...