ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,340, issued on Feb. 10, was assigned to Intel Corp. (Santa Clara, Calif.).
"Three-dimensional metal-insulator-metal capacitors" was invented by Denzil Frost (Rio Rancho, Idaho).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are IC devices with three-dimensional metal-insulator-metal capacitor structures. An example IC device implementing such capacitor structures includes studs of a first insulator material, an insulator material surrounding and in contact with upper-most portions of sidewalls of the studs, a first electrically conductive material surrounding bottom-most portions of the sidewalls of the studs, and a second electrical...