US Patent Issued to Intel on Feb. 10 for "Photonic integrated circuit packaging architectures" (Arizona, California Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,957, issued on Feb. 10, was assigned to Intel Corp. (Santa Clara, Calif.).

"Photonic integrated circuit packaging architectures" was invented by Kristof Kuwawi Darmawikarta (Chandler, Ariz.), Benjamin T. Duong (Phoenix), Srinivas V. Pietambaram (Chandler, Ariz.), Tarek A. Ibrahim (Mesa, Ariz.), Ala Omer (Phoenix), Bai Nie (Chandler, Ariz.) and Hari Mahalingam (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include an integrated circuit (IC) in a first la...