US Patent Issued to Intel on Feb. 10 for "Packaging architecture with reinforcement structure in package substrate" (German, American Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,736, issued on Feb. 10, was assigned to Intel Corp. (Santa Clara, Calif.).

"Packaging architecture with reinforcement structure in package substrate" was invented by Mohan Prashanth Javare Gowda (Ottobrunn, Germany), Stephan Stoeckl (Schwandorf, Germany), Sonja Koller (Bavaria, Germany), Wolfgang Molzer (Ottobrunn, Germany), Thomas Wagner (Regelsbach, Germany) and Pouya Talebbeydokhti (Gilbert, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of a microelectronic assembly include a package substrate comprising: a first layer comprising a first plurality of mutually parallel channels of a first material; a second layer comprising colu...